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Konten disediakan oleh Embedded Computing Design. Semua konten podcast termasuk episode, grafik, dan deskripsi podcast diunggah dan disediakan langsung oleh Embedded Computing Design atau mitra platform podcast mereka. Jika Anda yakin seseorang menggunakan karya berhak cipta Anda tanpa izin, Anda dapat mengikuti proses yang diuraikan di sini https://id.player.fm/legal.
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Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024

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Konten disediakan oleh Embedded Computing Design. Semua konten podcast termasuk episode, grafik, dan deskripsi podcast diunggah dan disediakan langsung oleh Embedded Computing Design atau mitra platform podcast mereka. Jika Anda yakin seseorang menggunakan karya berhak cipta Anda tanpa izin, Anda dapat mengikuti proses yang diuraikan di sini https://id.player.fm/legal.

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On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.

Next, Rich is joined by Sayeed Ahmed, director at Infineon Technologies, to discuss the electrification of software-defined vehicles, according to Ahmed, there are still some tradeoffs and issues to be solved.

But first, Rich gives us a sneak peek into his trip to Munich for electronica 2024. Stay tuned to hear about the sessions and the top innovators of our Best-in-Show awards.

For more information, visit embeddedcomputing.com

  continue reading

261 episode

Artwork
iconBagikan
 
Manage episode 450169384 series 2132334
Konten disediakan oleh Embedded Computing Design. Semua konten podcast termasuk episode, grafik, dan deskripsi podcast diunggah dan disediakan langsung oleh Embedded Computing Design atau mitra platform podcast mereka. Jika Anda yakin seseorang menggunakan karya berhak cipta Anda tanpa izin, Anda dapat mengikuti proses yang diuraikan di sini https://id.player.fm/legal.

Send us a text

On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.

Next, Rich is joined by Sayeed Ahmed, director at Infineon Technologies, to discuss the electrification of software-defined vehicles, according to Ahmed, there are still some tradeoffs and issues to be solved.

But first, Rich gives us a sneak peek into his trip to Munich for electronica 2024. Stay tuned to hear about the sessions and the top innovators of our Best-in-Show awards.

For more information, visit embeddedcomputing.com

  continue reading

261 episode

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