Addressing The Challenges In Advanced Logic Semiconductor Manufacturing Inside Electronics podcast

Artwork

Tech Endeavor Business Media

Konten disediakan oleh Endeavor Business Media. Semua konten podcast termasuk episode, grafik, dan deskripsi podcast diunggah dan disediakan langsung oleh Endeavor Business Media atau mitra platform podcast mereka. Jika Anda yakin seseorang menggunakan karya berhak cipta Anda tanpa izin, Anda dapat mengikuti proses yang diuraikan di sini https://id.player.fm/legal.

Inside Electronics « »
Addressing the Challenges in Advanced Logic Semiconductor Manufacturing

1M ago 19:03

Bagikan

MP3•Beranda episode

Konten disediakan oleh Endeavor Business Media. Semua konten podcast termasuk episode, grafik, dan deskripsi podcast diunggah dan disediakan langsung oleh Endeavor Business Media atau mitra platform podcast mereka. Jika Anda yakin seseorang menggunakan karya berhak cipta Anda tanpa izin, Anda dapat mengikuti proses yang diuraikan di sini https://id.player.fm/legal.

Making logic chips has never been an easy task, and it is one that has been further challenged by advances in scaling as well as advanced topologies like chiplets. From the race to 2nm-foundry creation for next-generation wafer development and the related issues of packaging, engineers must develop new solutions. In this episode, we talk to Henri Richard, GM and president of Rapidus Design Solutions, about the state of the art and the solutions his company is developing.

… continue reading

32 episode

#Tech #Endeavor Business Media

Artwork

Addressing the Challenges in Advanced Logic Semiconductor Manufacturing

Inside Electronics

published 1M ago

Bagikan

MP3•Beranda episode

Konten disediakan oleh Endeavor Business Media. Semua konten podcast termasuk episode, grafik, dan deskripsi podcast diunggah dan disediakan langsung oleh Endeavor Business Media atau mitra platform podcast mereka. Jika Anda yakin seseorang menggunakan karya berhak cipta Anda tanpa izin, Anda dapat mengikuti proses yang diuraikan di sini https://id.player.fm/legal.

Making logic chips has never been an easy task, and it is one that has been further challenged by advances in scaling as well as advanced topologies like chiplets. From the race to 2nm-foundry creation for next-generation wafer development and the related issues of packaging, engineers must develop new solutions. In this episode, we talk to Henri Richard, GM and president of Rapidus Design Solutions, about the state of the art and the solutions his company is developing.

… continue reading

32 episode

#Tech #Endeavor Business Media

Все серии

×

Selamat datang di Player FM!

Player FM memindai web untuk mencari podcast berkualitas tinggi untuk Anda nikmati saat ini. Ini adalah aplikasi podcast terbaik dan bekerja untuk Android, iPhone, dan web. Daftar untuk menyinkronkan langganan di seluruh perangkat.

Dengarkan 500+ topik