30 Years of Underfill Technology: How Societal and Technological Challenges Impact Materials Development

3D InCites Podcast

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In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development.

The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, focusing on their compatibility, environmental impact, and properties.

You’ll learn about:

• The development of specialized underfill materials for advanced packaging technologies, including AI chips, and the challenges arising from material changes in electronics manufacturing
• Historical examples of working with restricted substances and how that created a need for alternative materials
• The current need for collaboration and innovation to address the issue of PFAS chemicals in products
• Why and how much testing is important to ensure material compatibility and performance

NAMICS
NAMICS Corporation provides advanced materials and solutions for the semiconductor industry.
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